Metal Finishing – Plating & Coating
Tin Plating
Solderability and corrosion protection for electronic and electromechanical parts.
← Metal Finishing – Plating & Coating
Process
Electrolytic deposition of high-purity tin. Used for corrosion prevention and conductivity on printed circuit boards and in systems that require solderability.
What it provides
- Solderability; matte and bright finishes
- Optional nickel underlayer to reduce whisker growth
- Non-toxic corrosion protection
Frequently asked questions
How is tin whisker growth prevented?
Plating over a nickel underlayer and post-plate annealing reduce whisker risk compared with bare matte tin. ASTM-B545 defines the measures; we recommend them for electronic assemblies.
Do you test solderability?
On request a solderability (wetting) test is reported per batch.
Have a drawing for this process?
Send your technical drawing or 3D CAD model through our secure channel. Our engineering team replies with a quotation against the specification.