Capabilities
Double-Side Polishing
Simultaneous polishing of both faces for optical windows where parallelism and thickness tolerance are critical.
Simultaneous processing of both faces on double-side (DGM/DPM) lines, for optical windows where parallelism and total thickness variation (TTV) are critical.
Technical scope
- Sub-micron TTV control
- Laser and infrared windows, wedges, filter substrates
- Up to ⌀ 500 mm
- Interferometric verification per batch
Frequently asked questions
When is double-side polishing needed?
For windows and filter substrates where parallelism and thickness tolerance are critical; both faces are processed together, giving sub-micron TTV.
Which materials does it cover?
Glass, fused silica, sapphire and infrared crystals, each with its own recipe.
Have a drawing for this process?
Send your technical drawing or 3D CAD model through our secure channel. Our engineering team replies with a quotation against the specification.