Metal Finishing – Plating & Coating
Gold Plating
Low contact resistance and oxidation protection; for electrical reliability in connectors, RF and electronic components.
Process
A high-purity gold layer is deposited electrolytically. Provides excellent conductivity with corrosion and chemical resistance; used on circuit boards and designs requiring high conductivity.
What it provides
- Low, stable contact resistance
- Resistance to oxidation and sulphurous atmospheres
- High conductivity on RF and microwave surfaces
Frequently asked questions
Why is gold plated over a nickel underlayer?
The nickel underlayer stops gold diffusing into the copper base and keeps contact resistance from rising over time. MIL-DTL-45204 and ASTM-B488 assume this structure.
What thickness and purity are used?
0.5–2.5 µm for connector and RF work, in hard (cobalt-alloyed) or pure gold. Thickness is verified by X-ray.
Have a drawing for this process?
Send your technical drawing or 3D CAD model through our secure channel. Our engineering team replies with a quotation against the specification.